BONDING ADHESIVES
Bonding prevents everything from failing just because something has fallen off – no matter which bit is affected. Bonding means fastening parts and keeping them in this position, whatever happens. Even for material thicknesses in the nanometre range. We at WERNER WIRTH like making things inseparable. Including our business relationships.
Adhesives are an effective method for joining, protecting, or sealing parts without the need for mechanical fasteners. The use of adhesives in component protection offers several advantages:
Overall, adhesives in component protection offer a flexible, reliable, and effective solution for enhancing the performance, durability, and reliability of products across a wide range of applications. These are utilized in the electronics industry, mechanical engineering, the automotive industry, and many other areas.
You can rely on the very best consulting expertise, for example, when it comes to permanent connections to or on printed circuit boards. We offer decades of experience, for example, when it comes to how liquid the adhesive must or may be, whether it should be conductive or insulating and whether it should be applied to the part as underfill or glop top – or whether you should even be able to see through it (optical bonding).
We have the right adhesive for absolutely everything and swear by the Bectron® product range by ELANTAS, from the all-rounder polyurethane via very hard epoxy resins to flexible one- and two component silicones. As versatile super adhesive, we recommend cyanoacrylate in the form of Bostik Born2Bond™.
Please find below just a brief excerpt from our comprehensive range of products. Do contact us to find and obtain the right adhesive for your specific task. Our adhesives keep what we promise. And you can gladly take that literally.
Polyurethane can be used for many different purposes and is well-known for its universal suitability. From flexible to hard, it adheres well to many substrates and stands out with good to very good resistance to many substances. You can use one- or two-component polyurethane, depending on the circumstances. Modified polyurethane can be cured with UV light.
One-component polyurethane (1C PUR adhesive) cures to an elastomer by absorbing moisture from the air. 1C PUR adhesive is usually pasty and stable. It is applied with a handgun or processing machine in beads to reach layers of approx. 3 to more than 10 mm thick. WERNER WIRTH also offers solvent-free, UV-curing and heat-curing polyurethane.
Bectron® AR 4820 N is a one-component resin on polyurethane basis with medium viscosity that cures rapidly by reacting with moisture in the atmosphere to form a flexible material that is suitable for sealing and protecting parts and connections on the printed circuit board.
Bectron® AR 4820 fulfils the requirements of the ROHS.
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Bectron® PT 4834 is a one-component system based on polyurethane that cures quickly in reaction with atmospheric moisture and forms a soft, flexible material. Suitable for sealing and protecting components and connections on the printed circuit board.
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Bectron® PT 4842 is a low-viscosity one-component polyurethane that cures quickly in reaction with atmospheric moisture. It forms a flexible material that is suitable for sealing and protecting parts and connections on the printed circuit board.
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Bectron® PT 4840 is a one-component, thixotropic polyurethane that cures in reaction with atmospheric moisture into a soft, flexible material. For sealing and protecting components and connections on the printed circuit board.
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Bectron® PT 4830 is a one-component, thixotropic polyurethane that cures quickly in reaction with atmospheric moisture into a soft, flexible material. It is suitable for sealing and protecting components and connections on the printed circuit board.
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PK 4340 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate. Heating the resin releases the encapsulated polyisocyanate, which forms a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4340 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.
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Bectron® PK 4342 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate. Heating the resin releases the encapsulated polyisocyanate, which forms a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4342 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.
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Bectron® PK 4344 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected to permit controlled rheology including excellent thixotropic properties. Heating the resin releases the encapsulated polyisocyanate. This triggers a polyaddition reaction that generates a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4344 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.
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The cured material has high elasticity and high strength, resulting in outstanding temperature cycle behaviour in the range from -60 °C to +125 °C as well as high vibration strength. This warrants minimum cracking even with thick-film applications. Bectron® PK 4344 has excellent chemical resistance to a large number of aggressive fluids frequently used in the automotive industry. Furthermore, Bectron® PK 4344 shows good adhesion to nearly all materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Fulfils the ROHS directives.
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In cured state, Bectron® PK 4344 is a soft duroplastic suitable for vibration protection of sensitive parts. Bectron® PK 4344 is suitable for partial or selective coating of SMDs and other modules on printed circuit boards and ceramic substrates. It has low viscosity. In rapid coating, this permits a thinner film than types with higher viscosity. This low viscosity is ideal for minimising air bubbles inclusions in complex potting applications. When used as potting resin, it is suitable for sensors, automotive electronics, connectors etc.
Bectron® PK 4364 is a blue one-component resin system that cures to a polyurethane duroplastic with a certain flexibility. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected to permit controlled rheology. Heating the resin releases the encapsulated polyisocyanate again. This triggers a polyaddition reaction that generates a resistant duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4364 B is ready for use. It stands out with outstanding properties and particularly good environmental compatibility.
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The use of Bectron® PK 4364 B guarantees smooth, homogeneous coating of edges and pins. This coating protects the parts from mechanical damage and offers very good dielectric properties. The cured material has high elasticity and high strength, leading to very good temperature cycle behaviour in the range from -50 °C to +125 °C. This results in minimum cracking, even with thick films. Bectron® PK 4364 B has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications. Bectron® PK 4364 B also shows very good adhesion on most materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Fulfils the ROHS directives
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Bectron® PK 4364 B is used as coating and potting resin for SMT printed circuit boards and ceramic substrates, e.g. sensors.
Bectron® PK 5542 is a one-component resin system that cures to a soft polyurethane duroplastic with high heat resistance. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected for controlled rheology including a certain thixotropic character, while offering outstanding heat resistance and stability. Heating the resin releases the encapsulated polyisocyanate. This triggers a polyaddition reaction that generates a soft cured duroplastic material.
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The cured material has high elasticity and high strength. Bectron® PK 5542 is suitable for temperatures of up to 150 °C. The material shows very good temperature cycle behaviour in the range from -50 °C to +140 °C and is resistant to vibrations. This results in minimum cracking even with thick-film applications. Bectron® PK 5542 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications. Bectron® PK 5542 offers good adhesion on nearly all materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond. Fulfils the ROHS directive
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In cured state, Bectron® PK 5542 is a soft duroplastic which is suitable for protecting sensitive parts from chemicals, shock and vibration when these are exposed to high temperatures. Bectron® PK 5542 is used for partial or selective coating of SMDs and other modules on printed circuit boards and ceramic substrates. It can also be used as potting resin for electronic parts and sensors, automotive electronics, connectors etc. up to a temperature of 150 °C. It has moderate viscosity with slightly thixotropic properties and is suitable for selective thick film coating of components or for potting printed circuit boards or hybrids in housings.
Bectron® PT 4600 is a polyurethane-based, solvent-free, one-component transparent material that is suitable for thick film coating. It is cured by UV light and moisture (for shadow zones). The cured product is elastic and flexible in low temperatures down to -40 °C and shows good adhesion on most substrates. Bectron® PT 4600 offers outstanding insulation properties.
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Bectron® PT 4601 is a solvent-free, one-component, transparent polyurethane material that is suitable for thick film coatings. It is cured by UV light and moisture (for shadow zones). It has thixotropic properties for applications on selected areas on the printed circuit board. The cured product is elastic and flexible in low temperatures down to -40 °C and shows good adhesion on most substrates. Bectron® PT 4601 offers excellent insulation properties.
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Bectron® PT 4606 is a solvent-free, one-component, transparent polyurethane material that is suitable for thick film coatings. It is cured by UV light and moisture (for shadow zones). It has thixotropic properties for applications on selected areas on the printed circuit board. Its high viscosity and thixotropic properties permit precise application on selected areas of the printed circuit board (e.g. suitable for sealing), for protecting parts or connections on the PCB or as dam for dam-and-fill applications.
The cured product is elastic and flexible in low temperatures down to -40 °C and shows good adhesion on most substrates. Bectron® PT 4606 offers outstanding insulation properties.
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Two-component polyurethane stands out with high structural strength and good ageing properties. It is resistant to UV and to the weather and is capable of bridging relatively large gaps. PUR 2C adhesive is suitable for large-surface bonding.
It is quick, easy and clean to process. WERNER WIRTH offers cold-flexible, crystal-clear and self-extinguishing 2C polyurethane.
Bectron® PB 3251 with hardener Bectron® PH 4918 forms a two-component system for making an elastic compound that is suitable for potting. It is based on polybutadiene with polyurethane which is filled to warrant strength with flexibility at low temperatures and good resistance properties. It is resistant to organic and inorganic solvents. It is solvent-free and does not damage any components on the PCB.
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Bectron® PB 3251 is suitable for many potting applications that require stability toward thermal shock. It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.
Bectron® PB 3252 with hardener Bectron® PH 4916 is a two-component system that generates a flexible compound suitable for potting. It is based on polyurethane/polybutadiene and offers good flexibility at low temperatures and outstanding resistance properties. It is resistant to organic and inorganic solvents. It cures with low shrinkage and shows good adhesion on most substrates. It is solvent-free and does not damage any components on the printed circuit board.
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Bectron® PB 3201 with hardener Bectron® PH 4918 forms a two-component system that generates a flexible compound suitable for potting. Based on polyurethane/polybutadiene, it offers good flexibility at low temperatures. It is resistant to organic and inorganic solvents. It cures with low shrinkage and shows good adhesion on most substrates. It is solvent-free and does not damage any components on the printed circuit board.
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Bectron® PU 4515 is a two-component liquid polyurethane system that is modified with polybutadiene. It has high flexibility and rubber-like properties, even at low temperatures. It is cured with the hardener Bectron® PH 4912. The system fulfils the requirements of ROHS.
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Elastic potting compound for mechanically sensitive electronic components and printed circuit board assemblies.
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Epoxy resin offers the best results for all materials with structural strength. Epoxy resin covers the temperature range up to 180°C, is very hard and has a very low expansion coefficient, which is ideal for bonding metal.
The adhesive has one or two components, is free of solvents, does not develop any smell and stands out with good ageing properties. Epoxy resin is flame resistant, offers good thermal conductivity and is resistant. This adhesive cures at room temperature or by heating. Special epoxy resin can be cured with UV light.
These adhesives have one or two components, are free of solvents, do not develop any smell and stand out with good ageing properties. Epoxy resins are flame resistant, offer good thermal conductivity and are resistant. These adhesives cure at room temperature or by heating. Special epoxy resins can be cured with UV light.
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Elan-glue® EP 5620 is a solvent-free one-component adhesive.
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Elan-glue® EP 5340 is an adhesive for heat management applications
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Solvent-free one-component adhesive
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Glass bonding, metal bonding
These adhesives have one or two components, are free of solvents, do not develop any smell and stand out with good ageing properties. Epoxy resins are flame resistant, offer good thermal conductivity and are resistant. These adhesives cure at room temperature or by heating. Special epoxy resins can be cured with UV light.
Elan-glue® EP 5610 is a thermal/UV-curing one-component adhesive
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Elan-glue® EP 5611 is a thermal/UV-curing one-component adhesive.
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Silicone comes into play when epoxy, polyurethane and acrylic meet their temperature limits. Silicone is ideal for flexible use at low temperatures (-50°C) and also at up to 200 °C. It therefore offers the widest temperature range for its use.
Silicone is usually quite soft (max. Shore A 60) and is available as coloured or colourless material, depending on requirements. Its adhesion properties can be further improved for example by thermal treatment.
Bectron® SA 70L1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Bectron® SA 70P1-15 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Bectron® SA 7OP1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Bectron® SA 70V1-36 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Bectron® SC 76V1-36 is a translucent silicone that is suitable for coatings. It was specially developed to comply with the latest requirements in the electronics industry in terms of corrosion. It also offers outstanding dielectric properties and protection from moisture under adverse environmental conditions. Bectron® SC 76V1-36 is a one-component, condensation-crosslinking product (alkoxy) that does not cause the typical inhibition problems of addition-crosslinking systems. It also shows excellent adhesion on most common substrates used in the electronics industry.
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Bectron® SA 70P1-15 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Bectron® SA 7OP1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Bectron® SA 70V1-36 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
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Cyanoacrylate is a polymerising substance with outstanding adhesion to many different materials and surfaces. This fast-acting adhesive can truly be called super glue! But that by no means exhausts its many positive properties for sustainable component protection.
WERNER WIRTH offers a wide range of instant and super-glue adhesives with outstanding properties. Whether one- or two components, whether dual cure (contact and UV light) or supplementary cure boosters and adhesion primers, outstanding cyanoacrylate is the professional instant adhesive to make sure everything is in position promptly and permanently. On a wide range of materials and surfaces. Absolutely. And when we say super glue, we really mean a super adhesive that has nothing in common with the fast-acting glue you can buy at the DIY store.
The Bostik Born2Bond™ instant adhesive overcomes the application and performance barriers of previous instant adhesives with outstanding properties. The super adhesive cures instantly, it is low-odour and low-blooming so it remains transparent and does not turn white. Safe. Sustainable. Pioneering.
One-component instant adhesive – contact curing
One-component contact-curing instant adhesives in the WERNER WIRTH range are available in different viscosities, sizes and formats. From the 20 g bottle for manual dispensing via 500g containers for use with automatic dispensers and machines through to the practical gel in aluminium tubes (5g and 20g) for high-precision manual application.
Born2Bond™ ULTRA. Ultra adhesives are low-odour, low-blooming instant adhesives with a range of viscosities specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.
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* depending on substrates. ** except polyolefins
Born2Bond™ ULTRA MV. Ultra adhesives are low-odour, low-blooming instant adhesives with a range of viscosities specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.
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* depending on substrates. ** except polyolefins
Born2Bond™ ULTRA HV. Ultra adhesives are low-odour, low-blooming instant adhesives with a range of viscosities specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.
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* depending on substrates. ** except polyolefins
Born2Bond™ ULTRA GEL is a low-odour, low-blooming instant adhesive specially designed for bonding most substrates including plastics, rubbers and metals. The formulation consistency has been designed for high bond strength, even in places that are subject to flexing. The gel consistency permits application in every orientation. Careful selection of the formulation ingredients ensures that the product does not leave a white stain (blooming) near the bond.
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* depending on substrates. ** except polyolefins
Born2Bond™ LIGHT LOCK HV are low-odour, low-blooming, dual-curing (contact and light curing) cyanoacrylate adhesives. They are ideal for instant bonding or coating. Their sensitivity to UV light and visible light allows rapid bonding through transparent parts and quick curing of light-exposed areas or coated surfaces, while the bonding capability ensures cure between opaque substrates (contact cure).
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* depending on substrates ** except polyolefins
Born2Bond™ LIGHT LOCK GEL are low-odour, low-blooming, dual-curing (contact and light curing) cyanoacrylate adhesives. They are ideal for instant bonding or coating. Their sensitivity to UV light and visible light allows rapid bonding through transparent parts and quick curing of light-exposed areas or coated surfaces, while the bonding capability ensures cure between opaque substrates (contact cure).
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Two-component super adhesive: syringes and handguns
The two-component (2C) super adhesives in the WERNER WIRTH range are available in 10 g syringes for manual application and in 50 g syringes for use with dispensing handguns. Both products are compatible with static disposable mixers.
Born2Bond™ FLEX is a flexible, elastic and low-odour instant adhesive with exceptional adhesion to a very broad range of materials and surfaces. It has a curing time of six minutes and becomes a polymer with more than 200% elongation in up to 10 minutes. It can be used for filling larger gaps and achieves instant adhesion to most plastics, woods and metals as well as to porous and irregular surfaces.
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*Depending on gaps and substrates. ** except polyolefins
Born2Bond™ STRUCTURAL is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bonding gaps up to 5mm. This product offers excellent bonding properties to a large variety of closed substrates, such as aluminium, plastics and elastomers as well as porous substrates such as woods, chipboard and leather. Born2Bond™ STRUCTURAL is formulated for applications that require mechanical and in-use environmental resistance.
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*Depending on gaps and substrates. ** except polyolefins
Born2Bond™ REPAIR is a gap-filling instant adhesive and repair product with excellent adhesion to a very broad range of materials. Repair is ideal for instant bonding and repairing because it combines the strength of a structural adhesive with the speed of an instant adhesive. A tough polymer is achieved within a curing time of under 10 minutes. The gel consistency permits application in every orientation
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*Depending on gaps and substrates. ** except polyolefins
Boosters and primers: the adhesion catalysts
The performance catalysts in WERNER WIRTH’s cyanoacrylate range guarantee the required results even under difficult prerequisites. Boosters (bond activator) accelerate the curing of adhesives when time is at a premium. Primers (adhesion agent) create a bonding layer between material and adhesive, ensuring optimum adhesion properties and excellent bonding even on surfaces with extremely poor adhesive properties.
Born2Bond™ BOOSTER is a surface preparation product that accelerates the curing of cyanoacrylate. It was designed specifically for curing on acidic surfaces, such as wood, and on porous surfaces. The long open time and short drying time make it the ideal choice for professionals. In contrast to other boosters, Born2Bond™ BOOSTER is ideal particularly for boosting fast adhesion when bonding parts exposed to direct high loads, such as edge coating or shoe soles.
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Born2Bond™ PRIMER is used to improve the bonding of polyolefins and other low surface-energy substrates with cyanoacrylate adhesives. It is only recommended for substrates that are difficult to bond, such as polyethylene, polypropylene, polytetrafluorethylene (PTFE) and thermoplastic rubber materials. Born2Bond™ PRIMER is not recommended for applications with high peel strength.
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Do you have questions about various adhesives, or would you like to have a conversation with us?
Feel free to use our contact form or give me a call: +49 40 75 24 9165.
We look forward to exchanging thoughts with you.
Sincerely,
Dr. Maria Wiechert