POTTING COATINGS
All-round component protection Potting material.
Potting whole modules in their housing demands plenty of know-how about torsion and temperature resistance. Innovative solutions in particular often also entail thinking backwards.
With potting materials, we always begin at the end: the finished final product at its place of use. Nothing shocks WERNER WIRTH any more: we even know the best solution for strongest vibrations or temperature fluctuations like those in the desert.
We know what we’re doing and work together with you to find that special material that is robust and resilient in accordance with the requirements. WERNER WIRTH supplies one- and two-component solutions, polyurethane and polybutadiene, silicone and epoxy resins. You can also benefit from fast test series in our Working Lab, combined with many years of experience that can even eliminate the need for testing at all.
Advantages and Benefits of Potting Coatings in Electronic Component Protection
Potting coatings are used in numerous industries to enhance the durability, performance, and reliability of electronic components and assemblies. Encapsulation materials protect electronic parts from environmental influences and mechanical stress. The application of casting resins, often referred to as Potting, offers several advantages for customers and users:
- Comprehensive Protection: Encapsulation materials provide excellent protection for electronics against moisture, dust, dirt, and chemical substances. They prevent the corrosion of metal parts and protect electrical components from the infiltration of harmful substances, thereby increasing the lifespan and reliability of the devices.
- Thermal Management: Potting coatings aid in the dissipation of heat from electronic components. They can redirect heat away from heat-sensitive parts to cooler areas of the assembly or casing. This enhances the overall performance and reduces the risk of overheating.
- Improvement of Mechanical Strength: Encasing components in resin enhances their mechanical strength. This protects the components from vibrations, shocks, and other physical stresses that may occur during transportation or in the application itself.
- Isolation and Protection Against Electrical Disturbances: Potting coatings provide excellent electrical insulation, protect against short circuits, and prevent electrical disturbances that can be caused by neighboring electronic devices.
- Containment of Creep Currents and Prevention of Arcing: The high insulating effect of encapsulation materials prevents creep currents and the formation of arcs between closely spaced electrical lines, which enhances the safety of electronic devices.
- Design Flexibility: Potting coatings allow designers and engineers to protect components in complex or unusual shapes, as the resin fills all spaces and forms a solid, custom-fit protective layer upon curing. This is only feasible once a housing or frame is present.
- Extension of Product Lifespan: By protecting against environmental factors and mechanical stresses, casting resins help to extend the lifespan of electronic components and systems, leading to lower maintenance costs and fewer failures.
- Aesthetics and Finish: In addition to functional protection, Potting coatings can also enhance the aesthetic appearance of components and create a uniform, clean surface. They are available in various colours and finishes, allowing for customisation to match the design of the final product.
- Ease and Versatility in Application: Casting resins are poured and cure at room temperature or through the application of heat, allowing for flexible use in production.
Overall, Potting coatings and the process offer crucial advantages for the durability, reliability, and performance of electronic components and devices, making them a valuable option for manufacturers and users across many industries.
More than just background: complete part potting
PROTECTIONPotting resins for the toughest and most adverse conditions and weather
Potting is recommended for the most adverse applications or extreme environmental conditions, e.g. for offshore components. Here we use proven, economical cast resin by BECTRON and supply you with one- and two-component solutions, polyurethanes and polyolefins, silicones and epoxy resin by Elantas – right in line with your specific requirements.
Our range: BECTRON® potting resins by Elantas
To give you a quicker overview of our range of BECTRON potting resins by Elantas, we have broken the potting resins down according to temperature resistance: from silicones with high thermal resistance via thermal resistances to 150 °C resp. 125 °C to good low-temperature flexibility, which can also be an important requirement.
This is followed by a selection of clear and transparent materials for many different applications.
Silicones with high temperature resistance
Electronic component coatings for up to 200 °C
Bectron® SA 70L1-30 is a one-component, condensation-crosslinking product (alkoxy) that is not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
Properties:
- Neutral curing
- Good dielectric properties
- Self-levelling
- Good adhesion on most substrates
- Temperature resistant from -55 °C 200 °C
Applications:
Installation and insulation of electronic and electric components
and devices, sealing and bonding of parts sensitive to corrosion.
Bectron® SA 70P1-15 is a one-component, condensation-crosslinking product (alkoxy). It is thixotropic and not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
Properties:
- Neutral curing
- Good dielectric properties
- No slipping
- Good adhesion on most substrates
- Temperature resistant from -55 °C +200 °C
Applications:
- Installation of electric and electronic devices
- Sealing and bonding devices sensitive to corrosion
Bectron® SA 70P1-30 is a one-component, condensation-crosslinking product (alkoxy). It is thixotropic and not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
Properties:
- Neutral curing
- Good dielectric properties
- Thixotropic
- Good adhesion on most substrates
- Temperature resistant from -55 °C +200 °C
Applications:
- Installation of electric and electronic devices
- Sealing and bonding devices sensitive to corrosion
Bectron® SA 70V1-36 is a one-component, condensation-crosslinking product (alkoxy). It is thixotropic and not corrosive when in contact with sensitive electronic parts and substrates. It also has very good dielectric properties and excellent adhesion on most substrates used in the electronics industry. It is the ideal option for many electronic and lighting applications that demand high performance.
Properties:
- Neutral curing
- Good dielectric properties
- Self-levelling
- Good adhesion on most substrates
- Temperature resistant from -55 °C +200 °C
Applications:
- Installation of electric and electronic devices
- Sealing and bonding devices sensitive to corrosion
Bectron® SDC 76V1-18 is a transparent product containing slight amounts of solvent. This conformal coating is based on silicone chemistry and has been developed for dip coating and sprayed application. The product fulfils the latest requirements for electronics, low pin corrosion, outstanding edge coverage and rapid curing at room temperature. It offers superior performance in dielectric properties and moisture protection under environmental stress.
Properties:
- Outstanding thermal shock resistance
- Outstanding surface insulation resistance
- Controlled curing by evaporation of the solvent
- High specific volume resistance, also in high moisture conditions
- Good dielectric properties
- Resistant to moisture and dust contamination
- Resists weak acids and bases
- Good adhesion under thermocycling
- Good temperature resistance
- Contains UV trace pigment for inspection
Applications:
- The intended purpose consists in automatic or manual dip coating of printed circuit boards, such as PCBs in the transport industry, SMD components and entertainment electronics. Alternatively, it can also be used in automated spraying processes.
- The aromatics-free, silicone-free, nonpolar aliphatic solvent Bectron® CA 74V1-01 can be used as a cleaner. Bectron® ST 74V1-04 is suitable for preventing unintentional curing of Bectron® SDC 76V1-18 (e.g. during shift breaks).
Bectron® SG 75L2-30 mixed with Bectron® SG 79L5-30 cures to a transparent gel in approx. 48 hours at room temperature. Curing can be accelerated with heat. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -50 °C to +180 °C. A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Curing by addition reaction
- Curing at room temperature
- Long processing time
- Curing can accelerated with heat
- Long-term thermal resistance
- Elasticity
- Low hardness
- Classified to UL 94 V0
Applications:
Bectron® SG 75L2-30 crosslinked with Bectron® SG 79L5-30 is specially suited to protecting electronic components from mechanical load and vibration when high thermal conductivity is required. Accelerated curing at high temperature facilitates use in mass production lines.
Bectron® SG 75V1-15 mixed with Bectron® SG 79V1-15 cures at room temperature to a transparent gel in approx. 24 hours. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -45 °C to +200 °C. A mixing ratio of 1:1 permits simple, safe processing of the system. If necessary, a soft, sticky gel can be obtained by changing the mixing ratio.
Properties:
- Addition-crosslinked system
- Curing at room temperature
- Curing can accelerated with heat
- Long-term thermal resistance
- Transparent and elastic
- Low hardness
Applications:
Bectron® SG 75V1-15 crosslinked with Bectron® SG 79V1-15 is specially developed for protecting electronic components from mechanical load and vibrations. Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-15 system is ideal for potting semiconductors in power modules.
Bectron® SG 75V1-75 mixed with Bectron® SG 79V1-75 cures at room temperature and forms a transparent gel in about 15 minutes. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -40 °C to +180 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Rapid curing at room temperature
- Long-term heat resistance
- Transparent and elastic
- Soft, elastic self-repairing gel
Applications:
- Bectron® SG 75V1-75 crosslinked with Bectron® SG 79V1-75 is specially developed for protecting electronic components from mechanical load and vibrations
- Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-75 system is ideal for potting semiconductors in power modules.
Bectron® SK 75V1-35 mixed with Bectron® SH 79V2-35 cures to a self-adhesive silicone rubber at a temperature of 120 °C in 1 hour. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +200 °C.
A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Good adhesion on various materials
- Low viscosity
- Good temperature resistance
- UL 94 V0-listed
Applications:
Thanks to its elastic properties and the long-term thermal resistance, the Bectron® SK 75V1-35 system is used successfully for encapsulating pressure-sensitive devices and for protecting motor windings in hot air systems. The Bectron® SK 75V1-35 system is also used generally to protect electronic parts and circuits, such as high-power semiconductors and high-load resistors.
Bectron® SK 75V2-35 mixed with Bectron® SH 79V5-35 cures to a resistant elastomer at toom temperature in 12 hours. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -50 °C to +180 °C. A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Curing at room temperature
- Curing can accelerated with heat
- Long-term temperature resistance
- Elasticity
- Low hardness
Applications:
Bectron® SK 75V2-35 crosslinked with Bectron® SH 79V5-35 is specially suited to protecting electronic parts and components (from high temperatures). Accelerated curing at high temperatures facilitates use in production lines.
Bectron® SK 75V2-45 mixed with Bectron® SH 79V2-45 cures to a flexible rubber in approx. 24 hours at room temperature. The elasticity and dielectric properties of the rubber remain essentially stable in a broad temperature range from -55 °C to +200 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Curing at room temperature
- Curing can be accelerated with heat
- Long-term heat resistance
- Low shrinkage
- Thermal conductivity
- Classified to UL 94 V0
Applications:
Thanks to its elastic properties and long-term thermal resistance, the Bectron® SK 75V2-45 system is used successfully for potting highly sensitive electronic components that are exposed to very high temperatures.
Bectron SK 75V2-65 mixed with hardener Bectron® SH 79V2-65 cures to a flexible rubber in approx. 24 hours at room temperature. The elasticity and dielectric properties of the rubber remain essentially stable in a broad temperature range from -40 °C to + 200 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Curing at room temperature
- Curing can be accelerated with heat
- Long-term heat resistance
- Low shrinkage
- Thermal conductivity
Applications:
Thanks to its elastic properties and long-term thermal resistance, the Bectron® SK 75V2-65 system is used successfully for encapsulating highly sensitive circuits and components that work in extreme operating conditions/high temperatures.
Bectron® SC 76V1-36 is a translucent silicone that is suitable for coatings. It was specially developed to comply with the latest requirements in the electronics industry in terms of corrosion. It also offers outstanding dielectric properties and protection from moisture under adverse environmental conditions. Bectron® SC 76V1-36 is a one-component, condensation-crosslinking product (alkoxy) that does not cause the typical inhibition problems of addition-crosslinking systems. It also shows excellent adhesion on most common substrates used in the electronics industry.
Properties:
- Rapid curing at room temperature
- Good dielectric properties
- Resistant to moisture and dust contamination
- Resistant to weak acids and bases
- Good adhesion on many substrates
- Temperature resistant from -55 °C to 200 °C
- Contains UV control trace pigment
- Good edge coverage
- Low volatile ingredients
Applications:
Coating electronics, e.g. PCBs, hybrids, SMD components, other individual components and consumer electronics.
Bectron® SK 76V2-75 is crosslinked by a condensation reaction. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +180 °C.
Properties:
- Condensation curing system
- Curing at room temperature
- Good thermal conductivity
- Long-term heat resistance
- Elasticity
- Classified to UL 94 V1
Applications:
The Bectron® SK 76V2-75 system is used successfully for potting coil heads and other parts. Furthermore, Bectron® SK 76V2-75 is suitable in general for protecting electronic components and circuitry such as high-power semiconductors and high-load resistors.
Thermal resistance to above 150 °C
Electronic coatings for above 150 °C
Bectron® EP 5502, VPE: 25 kg is an unfilled solvent-free two-component epoxy resin that cures at room temperature, developed for electronic applications.
Properties:
- High hardness
- High elasticity module
- Good thermal conductivity
- Good adhesion on heterogeneous materials
- Very good chemical resistance to grease, lubricants and petrol
- ROHS-compliant
Applications:
The Bectron® EP 5502 system is used for potting electronic parts that are used in adverse ambient conditions. The chemical properties and high thermal resistance also make it very well suited for electronic parts exposed to shock and vibration (e.g. automotive electronics) and for sensors.
Bectron® EP 5503 is a cold-curing two-component system that is free of solvents.
Curing with hardener Bectron® EH 5908 results in a hard moulding compound.
Properties:
- Moulding compound with very high thermal stability
- Thixotropic
- Hard moulding compounds
- Good adhesion on various substrates
Applications:
Bectron® EP 5503 with hardener Bectron® EH 5908 is suitable for protecting electric machines and devices such as stators, rotors, solenoids and transformers. The cured moulding compound has very high dimensional stability at high temperatures (according to Martens), which makes it the material of choice under high operating temperatures. High thermal stability is achieved after subsequent heat treatment of the moulding compound (for approx. 2 hours) at high temperature. In ready mixed state, Bectron® EP 5503 is thixotropic i.e. any flowing through narrow gaps of a moulding is essentially prevented until after curing.
Bectron® PB 3251 with hardener Bectron® PH 4918 forms a two-component system for making an elastic compound that is suitable for potting. It is based on polybutadiene with polyurethane which is filled to warrant strength with flexibility at low temperatures and good resistance properties. It is resistant to organic and inorganic solvents. It is solvent-free and does not damage any components on the PCB.
Properties:
- The cured material has high elasticity, flexibility and strength at low temperatures
- Low glass transition temperature
Applications:
Bectron® PB 3251 is suitable for many potting applications that require stability toward thermal shock. It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.
Bectron® PU 4515 is a two-component liquid polyurethane system that is modified with polybutadiene. It has high flexibility and rubber-like properties, even at low temperatures.
It is cured with hardener Bectron® PH 4912.
The system fulfils the requirements of ROHS.
Properties:
An elastic potting compound for mechanically sensitive electronic parts and printed circuit boards.
- Potting compound with rubber-like properties
- High temperature resistance up to 150 °C
- Flexible down to -60 °C
- Low shrinkage
- Good dielectric properties
- Good adhesion
- ROHS-compliant
Applications:
- Bectron® PU 4515 has excellent flexibility down to low temperatures
and is suitable for use in devices that are used in a broad temperature range
from -60 °C to + 150 °C - It is suitable for potting sensitive parts and printed circuit boards for outside use
- The high chemical resistance offers protection from moist, alkaline and acidic environments
Bectron® PU 4537 with hardener Bectron® PH 4913 results in a hard polyurethane potting compound with higher temperature stability than normal polyurethanes and very good electrical insulation properties.
Properties:
- Hard potting compound
- Recognised to UL 94 V0
- High thermal conductivity
- Low shrinkage
- Good dielectric properties
- Good chemical, oil and hydrolysis resistance
- Heat class F (155 °C)
Applications:
- Bectron® PU 4537 is suitable for potting devices where high mechanical strength is required and thermal conductivity up to 155 °C (e.g. temperature sensors for control systems, for use in automotive applications and for high-power resistors)
- Bectron® PU 4537 has good thermal conductivity and is recognised as per UL 94 class V0
Bectron® SG 75L2-30 mixed with Bectron® SG 79L5-30 cures to a transparent gel in approx. 48 hours at room temperature. Curing can be accelerated with heat. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -50 °C to +180 °C. A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Curing by addition reaction
- Curing at room temperature
- Long processing time
- Curing can accelerated with heat
- Long-term thermal resistance
- Elasticity
- Low hardness
- Classified to UL 94 V0
Applications:
Bectron® SG 75L2-30, crosslinked with Bectron® SG 79L5-30, is specially suited to protecting electronic components from mechanical load and vibration when high thermal conductivity is required. Accelerated curing at high temperature facilitates use in mass production lines.
Bectron® SG 75V1-15, VPE: 4 kg mixed with® SG 79V1-15 cures at room temperature to a transparent gel in approx. 24 hours. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -45 °C to +200 °C. A mixing ratio of 1:1 permits simple, safe processing of the system. If necessary, a soft, sticky gel can be obtained by changing the mixing ratio.
Properties:
- Addition-crosslinked system
- Curing at room temperature
- Curing can accelerated with heat
- Long-term thermal resistance
- Transparent and elastic
- Low hardness
Applications:
Bectron® SG 75V1-15 crosslinked with BECTRON SG 79V1-15 is specially developed for protecting electronic components from mechanical load and vibrations. Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-15 system is ideal for potting semiconductors in power modules.
Bectron® SK 75V1-35 mixed with Bectron® SH 79V2-35 cures to a self-adhesive silicone rubber at a temperature of 120°C in 1 hour. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +200 °C.
A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Good adhesion on various materials
- Low viscosity
- Good temperature resistance
- UL 94 V0-listed
Applications:
Thanks to its elastic properties and the long-term thermal resistance, the Bectron® SK 75V1-35 system is used successfully for encapsulating pressure-sensitive devices and for protecting motor windings in hot air systems. The Bectron® SK 75V1-35 system is also used generally to protect electronic parts and circuits, such as high-power semiconductors and high-load resistors.
Bectron® SG 75V1-75, VPE: 0.95 kg mixed with Bectron® SG 79V1-75 cures at room temperature and forms a transparent gel in about 15 minutes. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -40 °C to +180 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Rapid curing at room temperature
- Long-term heat resistance
- Transparent and elastic
- Soft, elastic self-repairing gel
Applications:
- Bectron® SG 75V1-75 crosslinked with Bectron® SG 79V1-75 is specially developed for protecting electronic components from mechanical load and vibrations
- Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-75 system is ideal for potting semiconductors in power modules.
Bectron SK® 75V2-65 mixed with hardener Bectron® SH 79V2-65 cures to a flexible rubber in approx. 24 hours at room temperature. The elasticity and dielectric properties of the rubber remain essentially stable in a broad temperature range from -40 °C to + 200 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Curing at room temperature
- Curing can be accelerated with heat
- Long-term heat resistance
- Low shrinkage
- Thermal conductivity
Applications:
Thanks to its elastic properties and long-term thermal resistance, the Bectron® SK 75V2-65 system is used successfully for encapsulating highly sensitive circuits and components that work in extreme operating conditions/high temperatures.
Bectron® SK 76V2-75 is crosslinked by a condensation reaction. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +180 °C.
Properties:
- Condensation curing system
- Curing at room temperature
- Good thermal conductivity
- Long-term heat resistance
- Elasticity
- Classified to UL 94 V1
Applications:
The Bectron® SK 76V2-75 system is used successfully for potting coil heads and other parts. Furthermore Bectron® SK 76V2-75 is suitable in general for protecting electronic components and circuitry such as high-power semiconductors and high-load resistors.
Thermal resistance up to 125 °C
Cast resin for operating temperatures up to 125 °C
Bectron® MR 3402 is a one-component melting resin developed for thick film coatings in electronic applications. As a thermoplastic, there is no curing reaction, just rapid solidification of the resin when it cools down.
Properties:
The tough melting resin Bectron® MR 3402 has a maximum operating temperature of 125 °C. It has excellent dielectric properties and shows very good adhesion on many different substrates across a temperature range from -30 °C to + 125 °C. It has low moisture absorption. It is also resistant among others to acids, bleaches and polar solvents.
- Not resistant to aliphatic aromatic compounds and chloric solvents
- Very easy to rework/touch up
- Reversible
- Fulfils the requirements of ROHS
- Coated area can be inspected under UV light
Applications:
- The dielectric properties of Bectron® MR 3402 make it ideal for electronic applications and as protection from moisture, corrosion, vibration and migration.
- Suitable for applying a thick film coating to printed circuit boards and parts to provide chemical protection and/or mechanical support.
- Offers protection from jolts and vibrations
- It can be applied selectively around individual components or across a wide area.
- Bectron® MR 3402 is recommended for mass production where fast process times are required (where no curing oven is necessary)
Bectron® PB 3200 (including set) with hardener Bectron® PH 4917 forms a two-component system for making a highly flexible potting material. It is based on polyurethane with polybutadiene to offer good flexibility at very low temperatures and outstanding resistance properties. The mixed product has very low viscosity for rapid processing of large quantities.
Properties:
- The cured material has very high elasticity and flexibility
- It remains flexible at very low temperatures
- Low glass transition temperature Tg
- Fulfils the requirements of ROHS
Applications:
Bectron® PB 3200 is suitable for many applications, particularly where high temperature cycle resistance is required, but also where good protection is needed from moisture, aggressive chemicals, shock and vibration. Its flexibility permits mechanical removal for reworking or for making a cast of the potted unit.
Bectron® PB 3201 with hardener Bectron® PH 4918 forms a two-component system that generates a flexible compound suitable for potting. Based on polybutadiene, it offers good flexibility at low temperatures. It is resistant to organic and inorganic solvents. It cures with low shrinkage and shows good adhesion on most substrates. It is solvent-free and does not damage any components on the printed circuit board.
Properties:
- The cured material has high elasticity, flexibility and strength at low temperatures.
- Good electric properties
- Low glass transition temperature Tg (-63 °C)
- Fulfils the requirements of ROHS
Applications:
Bectron® PB 3201 is suitable for many potting applications that require stability toward thermal shock. It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.
Bectron® PB 3251 with hardener Bectron® PH 4918 forms a two-component system for making an elastic compound that is suitable for potting. It is based on polybutadiene with polyurethane which is filled to warrant strength with flexibility at low temperatures and good resistance properties. It is resistant to organic and inorganic solvents. It is solvent-free and does not damage any components on the PCB.
Properties:
- The cured material has high elasticity, flexibility and strength at low temperatures
- Low glass transition temperature
Applications:
Bectron® PB 3251 is suitable for many potting applications that require stability toward thermal shock. It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.
Bectron® PB 3252 with hardener Bectron® PH 4916 forms a two-component system that generates a flexible compound suitable for potting. It is based on polybutadiene and offers good flexibility at low temperatures and outstanding resistance properties. It is resistant to organic and inorganic solvents, while offering good adhesion. It cures with low shrinkage and shows good adhesion on most substrates. It is solvent-free and does not damage any components on the printed circuit board.
Properties:
The cured material has high elasticity and shows flexibility and strength at low temperatures.
- Good electric properties
- Low glass transition temperature Tg (-55 °C)
Applications:
- Bectron® PB 3252 is suitable for many potting applications that require stability toward thermal shocks.
- It is ideal for potting whole printed circuit boards that require good protection from moisture, aggressive chemicals, jolts and vibrations.
Bectron® PK 4340, VPE: 10 kg is a one-component resin system that cures into a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate. Heating the resin releases the encapsulated polyisocyanate, which forms a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4340 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.
Properties:
- The cured material has high elasticity and high strength, resulting in outstanding temperature cycle behaviour in the range from -60 °C to 125 °C.
- Bectron® PK 4340 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications
- Bectron® PK 4340 shows good adhesion to almost all materials used in electronics
- Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond
Applications:
- In cured state, Bectron® PK 4340 is a soft duroplastic, suitable for vibration protection of sensitive parts
- Bectron® PK 4340 is therefore ideal for partial or selective coating of SMDs and other component groups on printed circuit boards
- The rapid increase in viscosity with low shear allows protection of small areas of individual parts
- When thicker coating is required, Bectron® PK 4340 can be used as dam
- In the second step, the inner area is filled with a filling material (with lower viscosity, such as PK 4342)
Bectron® PK 4342, VPE: 10 kg is a one-component resin system that cures into a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate. Heating the resin releases the encapsulated polyisocyanate, which forms a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4342 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.
Properties:
- The cured material has high elasticity and high strength, even in temperature cycles in the range from -60 °C to 125 °C.
- Bectron® PK 4342 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications
- Bectron® PK 4342 shows good adhesion to almost all materials used in electronics
- Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Applications:
- In cured state, Bectron® PK 4342 is a soft duroplastic, suitable as protection for sensitive parts
- Bectron® PK 4342 is therefore ideal for selective coating of SMDs and other component groups on printed circuit boards
- Also used as potting material for electronic components and sensors and finds wide-spread use in automotive applications.
- Bectron® PK 4342 can be used as filling material in the dam-and-fill process (Bectron® PK 4342 acts as dam in the first step of the process)
Bectron® PK 4344 is a one-component resin system that cures to a soft polyurethane duroplastic. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected to permit controlled rheology including excellent thixotropic properties. Heating the resin releases the encapsulated polyisocyanate. This triggers a polyaddition reaction that generates a resistant, duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4344 is ready to use and stands out with outstanding properties and particularly good environmental compatibility.
Properties:
The cured material has high elasticity and high strength, resulting in outstanding temperature cycle behaviour in the range from -60 °C to +125 °C as well as high vibration strength. This warrants minimum cracking even with thick-film applications. Bectron® PK 4344 has excellent chemical resistance to a large number of aggressive fluids frequently used in the automotive industry. Furthermore, Bectron® PK 4344 shows good adhesion to nearly all materials used in electronics.
Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Fulfils the ROHS directives.
Applications:
In cured state, Bectron® PK 4344 is a soft duroplastic suitable for vibration protection of sensitive parts. Bectron® PK 4344 is suitable for partial or selective coating of SMDs and other modules on printed circuit boards and ceramic substrates. It has low viscosity. In rapid coating, this permits a thinner film than types with higher viscosity. This low viscosity is ideal for minimising air bubbles inclusions in complex potting applications. When used as potting resin, it is suitable for sensors, automotive electronics, connectors etc.
Bectron® PK 4364, VPE: 10 kg is a blue one-component resin system that cures to a polyurethane duroplastic with a certain flexibility. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected to permit controlled rheology. Heating the resin releases the encapsulated polyisocyanate again. This triggers a polyaddition reaction that generates a resistant duroplastic cured material. In contrast to usual two-component resin systems, Bectron® PK 4364 B is ready for use. It stands out with outstanding properties and particularly good environmental compatibility.
Properties:
The use of Bectron® PK 4364 B guarantees smooth, homogeneous coating of edges and pins. This coating protects the parts from mechanical damage and offers very good dielectric properties. The cured material has high elasticity and high strength, leading to very good temperature cycle behaviour in the range from -50 °C to +125 °C. This results in minimum cracking, even with thick films. Bectron® PK 4364 B has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications. Bectron® PK 4364 B also shows very good adhesion on most materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond.
Fulfils the ROHS directive
Applications:
Bectron® PK 4364 B is used as coating and potting resin for SMT printed circuit boards and ceramic substrates, e.g. sensors.
Bectron® PK 5542, VPE: 0.19 kg is a one-component resin system that cures to a soft polyurethane duroplastic with high heat resistance. It consists of a liquid polyol system with a dispersed, firmly encapsulated polyisocyanate, and a pigment combination selected for controlled rheology including a certain thixotropic character, while offering outstanding heat resistance and stability. Heating the resin releases the encapsulated polyisocyanate. This triggers a polyaddition reaction that generates a soft cured duroplastic material.
Properties:
The cured material has high elasticity and high strength. Bectron® PK 5542 is suitable for temperatures of up to 150 °C. The material shows very good temperature cycle behaviour in the range from -50 °C to +140 °C and is resistant to vibrations. This results in minimum cracking even with thick-film applications.
Bectron® PK 5542 has excellent chemical resistance to a large number of aggressive fluids commonly used in automotive applications. Bectron® PK 5542 has good adhesion on nearly all materials used in electronics. Even after several temperature cycles, there is no loss of mechanical and electrical properties in the bond. Fulfils the ROHS directive.
Applications:
In cured state, Bectron® PK 5542 is a soft duroplastic which is suitable for protecting sensitive parts from chemicals, shock and vibration when these are exposed to high temperatures. Bectron® PK 5542 is used for partial or selective coating of SMDs and other modules on printed circuit boards and ceramic substrates. It can also be used as potting resin for electronic parts and sensors, automotive electronics, connectors etc. up to a temperature of 150 °C. It has moderate viscosity with slightly thixotropic properties and is suitable for selective thick film coating of components or for potting printed circuit boards or hybrids in housings.
Bectron® PU 4501 with hardener Bectron® PH 4901 forms a two-component system that cures to a very soft, transparent, elastic polyurethane plastic. The low-viscous resin/hardener mixture is suitable for potting and coating applications.
Properties:
- The resin compound cures with low shrinkage and heat development to a stress-free clearly cured resin
- The high elasticity ensures good temperature cycle behaviour
- Flexible down to -50 °C
- Low shrinkage
- Good dielectric properties
- Good adhesion on many materials
- ROHS-compliant
Applications:
- Suitable for potting and coating when the material needs to be visible
- Bonded circuits
- Sensors
- Reed relays
- LEDs
- SMD-components on printed circuit boards (rigid and semi-flexible) and on ceramic substrates
Bectron® PU 4513 is a soft, elastic polyurethane with low shrinkage, outstanding insulation properties and good mechanical and chemical protection. It is suitable for potting sensitive parts and printed circuit boards for outside use. It is cured with hardener Bectron® PH 4912.
Properties:
- High flexibility down to -40 °C
- Good dielectric properties
- Curing at room temperature
- Thermal curing possible
- Good thermal conductivity
- Solvent-free
Applications:
- The PU 4513 system is used for potting electronic parts that are sensitive to mechanical or thermal stress
- The elastic properties and the relatively good thermal conductivity make it very suitable for electronics and sensor technology exposed to jolts and vibrations (e.g. percussion drills and automotive electronics)
Bectron® PU 4515 is a two-component liqiud polyurethane system that is modified with polybutadiene. It has high flexibility and rubber-like properties, even at low temperatures. It is cured with hardener Bectron® PH 4912.
The system fulfils the requirements of ROHS.
Properties:
An elastic potting compound for mechanically sensitive electronic parts and printed circuit boards.
- Potting compound with rubber-like properties
- High temperature resistance up to 150 °C
- Flexible down to -60 °C
- Low shrinkage
- Good dielectric properties
- Good adhesion
- ROHS-compliant
Applications:
- Bectron® PU 4515 has excellent flexibility down to low temperatures and is suitable for use in devices that are used in a broad temperature range from -60 °C to + 150 °C.
- It is suitable for potting sensitive parts and printed circuit boards for outside use
- The high chemical resistance offers protection from moist, alkaline and acidic environments
Bectron® PU 4516 is a strong poluyrethane with low shrinkage and outstanding insulation properties. This material offers good mechanical and chemical protection. It has excellent adhesion and outstanding thermal resistance. It forms a low-viscous system to make potting easier. It is cured with hardener Bectron® PH 4912.
Properties:
- High temperature resistance up to 130 °C
- Good adhesion
- Good dielectric properties
- Curing at room temperature
- Thermal curing possible
- Low shrinkage
Applications:
The Bectron® PU 4516 system is suitable for potting electric and electronic components that have to be protected from chemical and mechanical stress.
Bectron® PU 4519 corresponds to the widely used Bectron® PU 4513 with the exception of higher viscosity. It is a soft, elastic polyurethane with low shrinkage, excellent insulation properties and good mechanical and chemical protection. It is cured with hardener Bectron® PH 4912.
Properties:
- A soft, elastic polyurethane potting compound that is suitable for potting sensitive electronic components and mounted printed circuit boards.
- Good dispensing possible
- High flexibility down to -40 °C
- Good dielectric properties
- Curing at room temperature
- Thermal curing possible
- Good thermal conductivity
- Solvent-free
- ROHS-compliant
Applications:
- The PU 4519 system is used for potting electronic parts that are sensitive to mechanical or thermal stress
- The high viscosity permits precise application
- The elastic properties and the relatively good thermal conductivity also make it very suitable for electronics and sensor technology exposed to jolts and vibrations (e.g. percussion drills and automotive electronics)
Bectron® PU 4522 is a two-component liquid polyurethane system. After curing with hardener Bectron® PH 4912, it forms a tough elastic potting compound that fulfils the flammability standard UL 94 V0.
Properties:
- Flame-retardant as per UL94 V0
- Flexibility at low temperatures down to -40 °C
- Curing at room temperature
- Robust, elastic curing potting compound
Applications:
- Bectron® PU 4522 is suitable for potting and sealing many kinds of electronic parts
- Bectron® PU 4522 is flame-retardant, fulfils the requirements as per UL 94 V0
- The elastic properties and the relatively good thermal conductivity also make it very suitable for electronics and sensor technology exposed to jolts and vibrations (e.g. percussion drills and automotive electronics)
- Application temperature range – 40 °C to +125 °C
Bectron® PU 4526 is a liquid two-component polyurethane system. After curing with hardener Bectron® PH 4912, it forms a medium-hard moulding compound that fulfils flammability standard UL 94 V0.
Properties:
Elastic potting compound for mechanically sensitive electric/electronic compounds and printed circuit board assemblies.
- Flame-retardant as per UL94 V0
- Certified by UL (File E 140720)
- Heat class B (130 °C) as per IEC 85
- Curing at room temperature
- Robust, elastic curing compound
- Pleasant processing viscosity
- ROHS-compliant
Applications:
- Bectron® PU 4526 is suitable for potting and sealing many kinds of electronic parts, e.g. printed circuit board assemblies
- Bectron® PU 4526 is flame-retardant as per standard UL 94 V0
- The physical properties and relatively high thermal resistance also make it very well suited for electronics subjected to shock and vibration (e.g. percussion drills and automotive electronics) as well as sensors
Bectron® PU 4527 in combination with hardener Bectron® PH 4912 is a highly viscous mixture with thixotropic flow properties that allow precise dispensing, particularly for dam & fill applications. The mixture cures and forms a fairly hard polyurethane with low shrinkage and excellent insulation properties with mechanical and chemical protection. The system fulfils the ROHS requirements.
Properties:
- A fairly hard, elastic polyurethane potting compound – suitable for potting sensitive electronic parts and mounted printed circuit boards
- Structural viscosity
- Precise protection
- Part of dam and fill systems
- Good thermal conductivity
- Curing at room temperature
- Accelerated thermal curing possible
- ROHS-compliant
Applications:
The PU 4527 system is suitable for coating and sealing sensitive parts of the printed circuit board where an exact, precise application line of resin is needed, particularly on connection pins and other important points that are exposed to corrosion or mechanical loads. The elastic properties and the relatively good thermal conductivity also make it very suitable for electronics and sensors exposed to jolts and vibrations (e.g. percussion drills and automotive electronics).
Bectron® PU 4534 is a two-component liquid polyurethane system. After curing with hardener Bectron® PH 4913, it forms a soft potting compound that fulfils the flammability standard UL 94 V0.
Properties:
- Flame-retardant to UL 94 V0
- Curing at room temperature
- Soft, elastic cured product
- Suitable processing viscosity
- ROHS-compliant
- Good thermal conductivity
Applications:
- Bectron® PU 4534 is suitable for potting and sealing many kinds of electronic parts and also on printed circuit boards
- Bectron® PU 4534 is flame-retardant, fulfils the requirements of standard UL 94 V0
- The physical properties and the relatively high thermal resistance also make it very suitable for electronics and sensor technology exposed to jolts and vibrations (e.g. percussion drills and automotive electronics)
Bectron® PU 4537, VPE: 1 kg Bectron® PU 4537 with hardener Bectron® PH 4913 results in a hard polyurethane potting compound with higher temperature stability than normal polyurethanes and very good electrical insulation properties.
Properties:
- Hard potting compound
- Recognised to UL 94 V0
- High thermal conductivity
- Low shrinkage
- Good dielectric properties
- Good chemical, oil and hydrolysis resistance
- Heat class F (155 °C)
Applications:
- Bectron® PU 4537 is suitable for potting devices where high mechanical strength is required and thermal conductivity up to 155 °C (e.g. temperature sensors for control systems, for use in automotive applications and for high-power resistors)
- Bectron® PU 4537 has good thermal conductivity and is recognised as per UL 94 class V0
Bectron® SG 75V1-15 mixed with Bectron® SG 79V1-15 cures at room temperature to a transparent gel in approx. 24 hours. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -45 °C to +200 °C. A mixing ratio of 1:1 permits simple, safe processing of the system. If necessary, a soft, sticky gel can be obtained by changing the mixing ratio.
Properties:
- Addition-crosslinked system
- Curing at room temperature
- Curing can accelerated with heat
- Long-term thermal resistance
- Transparent and elastic
- Low hardness
Applications:
Bectron® SG 75V1-15 crosslinked with BECTRON SG 79V1-15, is specially developed for protecting electronic components from mechanical load and vibrations. Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-15 system is ideal for potting semiconductors in power modules.
Bectron® SG 75L2-30 mixed with Bectron® SG 79L5-30 cures to a transparent gel in approx. 48 hours at room temperature. Curing can be accelerated with heat. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -50 °C to +180 °C. A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Curing by addition reaction
- Curing at room temperature
- Long processing time
- Curing can accelerated with heat
- Long-term thermal resistance
- Elasticity
- Low hardness
- Classified to UL 94 V0
Applications:
Bectron® SG 75L2-30 crosslinked with Bectron® SG 79L5-30 is specially suited to protecting electronic components from mechanical load and vibration when high thermal conductivity is required. Accelerated curing at high temperature facilitates use in mass production lines.
Bectron® SK 75V1-35, VPE: 1 kg mixed with Bectron® SH 79V2-35 cures to a self-adhesive silicone rubber at a temperature of 120 °C in 1 hour. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +200 °C.
A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Good adhesion on various materials
- Low viscosity
- Good temperature resistance
- UL 94 V0-listed
Applications:
Thanks to its elastic properties and the long-term thermal resistance, the Bectron® SK 75V1-35 system is used successfully for encapsulating pressure-sensitive devices and for protecting motor windings in hot air systems. The Bectron® SK 75V1-35 system is also used generally to protect electronic parts and circuits, such as high-power semiconductors and high-load resistors.
Bectron® SK 76V2-75 is crosslinked by a condensation reaction. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +180 °C.
Properties:
- Condensation curing system
- Curing at room temperature
- Good thermal conductivity
- Long-term heat resistance
- Elasticity
- Classified to UL 94 V1
Applications:
The Bectron® SK 76V2-75 system is used successfully for potting coil heads and other parts. Furthermore Bectron® SK 76V2-75 is suitable in general for protecting electronic components and circuitry such as high-power semiconductors and high-load resistors.
Good low-temperature flexibility
Protection for electronic components in particularly cold, adverse conditions
Bectron® EP 5502, VPE: 25 kg is an unfilled solvent-free two-component epoxy resin that cures at room temperature, developed for electronic applications.
Properties:
- High hardness
- High elasticity module
- Good thermal conductivity
- Good adhesion on heterogeneous materials
- Very good chemical resistance to grease, lubricants and petrol
- ROHS-compliant
Applications:
The Bectron® EP 5502 system is used for potting electronic parts that are used in adverse ambient conditions. The chemical properties and high thermal resistance also make it very well suited for electronic parts exposed to shock and vibration (e.g. automotive electronics) and for sensors.
Bectron® EP 5503 is a cold-curing two-component system that is free of solvents.
Curing with hardener Bectron® EH 5908 results in a hard moulding compound.
Properties:
- Moulding compound with very high thermal stability
- Thixotropic
- Hard moulding compounds
- Good adhesion on various substrates
Applications:
Bectron® EP 5503 with hardener Bectron® EH 5908 is suitable for protecting electric machines and devices such as stators, rotors, solenoids and transformers. The cured moulding compound has very high dimensional stability at high temperatures (according to Martens), which makes it the material of choice under high operating temperatures. High thermal stability is achieved after subsequent heat treatment of the moulding compound (for approx. 2 hours) at high temperature. In ready mixed state, Bectron® EP 5503 is thixotropic i.e. any flowing through narrow gaps of a moulding is essentially prevented until after curing.
Bectron® PB 3251 with hardener Bectron® PH 4918 forms a two-component system for making an elastic compound that is suitable for potting. It is based on polybutadiene with polyurethane which is filled to warrant strength with flexibility at low temperatures and good resistance properties. It is resistant to organic and inorganic solvents. It is solvent-free and does not damage any components on the PCB.
Properties:
- The cured material has high elasticity, flexibility and strength at low temperatures
- Low glass transition temperature
Applications:
Bectron® PB 3251 is suitable for many potting applications that require stability toward thermal shock. It is ideal for potting the whole printed circuit board to warrant good protection from moisture, aggressive chemicals and vibrations.
Bectron® PU 4515 is a two-component liquid polyurethane system that is modified with polybutadiene. It has high flexibility and rubber-like properties, even at low temperatures. It is cured with hardener Bectron® PH 4912.
The system fulfils the requirements of ROHS.
Properties:
An elastic potting compound for mechanically sensitive electronic parts and printed circuit boards.
- Potting compound with rubber-like properties
- High temperature resistance up to 150 °C
- Flexible down to -60 °C
- Low shrinkage
- Good dielectric properties
- Good adhesion
- ROHS-compliant
Applications:
- Bectron® PU 4515 has excellent flexibility down to low temperatures
and is suitable for use in devices that are used in a broad temperature range from -60 °C to + 150 °C. - It is suitable for potting sensitive parts and printed circuit boards for outside use
- The high chemical resistance offers protection from moist, alkaline and acidic environments.
Bectron® PU 4537 with hardener Bectron® PH 4913 results in a hard polyurethane potting compound with higher temperature stability than normal polyurethanes and very good electrical insulation properties.
Properties:
- Hard potting compound
- Recognised to UL 94 V0
- High thermal conductivity
- Low shrinkage
- Good dielectric properties
- Good chemical, oil and hydrolysis resistance
- Heat class F (155 °C)
Applications:
- Bectron® PU 4537 is suitable for potting devices where high mechanical strength is required and thermal conductivity up to 155 °C (e.g. temperature sensors for control systems, for use in automotive applications and for high-power resistors)
- Bectron® PU 4537 has good thermal conductivity and is recognised as per UL 94 class V0
Bectron® SG 75L2-30 mixed with Bectron® SG 79L5-30 cures to a transparent gel in approx. 48 hours at room temperature. Curing can be accelerated with heat. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -50 °C to +180 °C. A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Curing by addition reaction
- Curing at room temperature
- Long processing time
- Curing can accelerated with heat
- Long-term thermal resistance
- Elasticity
- Low hardness
- Classified to UL 94 V0
Applications:
Bectron® SG 75L2-30 crosslinked with Bectron® SG 79L5-30 is specially suited to protecting electronic components from mechanical load and vibration when high thermal conductivity is required. Accelerated curing at high temperature facilitates use in mass production lines.
Bectron® SG 75V1-15, VPE: 4 kg mixed with® SG 79V1-15 cures at room temperature to a transparent gel in approx. 24 hours. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -45 °C to +200 °C. A mixing ratio of 1:1 permits simple, safe processing of the system. If necessary, a soft, sticky gel can be obtained by changing the mixing ratio.
Properties:
- Addition-crosslinked system
- Curing at room temperature
- Curing can accelerated with heat
- Long-term thermal resistance
- Transparent and elastic
- Low hardness
Applications:
Bectron® SG 75V1-15 crosslinked with BECTRON SG 79V1-15, is specially developed for protecting electronic components from mechanical load and vibrations. Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-15 system is ideal for potting semiconductors in power modules.
Bectron® SG 75V1-75, VPE: 0.95 kg mixed with Bectron® SG 79V1-75 cures at room temperature and forms a transparent gel in about 15 minutes. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -40 °C to +180 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Rapid curing at room temperature
- Long-term heat resistance
- Transparent and elastic
- Soft, elastic self-repairing gel
Applications:
- Bectron® SG 75V1-75, crosslinked with Bectron® SG 79V1-75, is specially developed for protecting electronic components from mechanical load and vibrations
- Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-75 system is ideal for potting semiconductors in power modules.
Bectron® SK 76V2-75 is crosslinked by a condensation reaction. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +180 °C.
Properties:
- Condensation curing system
- Curing at room temperature
- Good thermal conductivity
- Long-term heat resistance
- Elasticity
- Classified to UL 94 V1
Applications:
The Bectron® SK 76V2-75 system is used successfully for potting coil heads and other parts. Furthermore Bectron® SK 76V2-75 is suitable in general for protecting electronic components and circuitry such as high-power semiconductors and high-load resistors.
Bectron SK® 75V1-35, VPE: 1 kg mixed with Bectron® SH 79V2-35 cures to a self-adhesive silicone rubber at a temperature of 120 °C in 1 hour. The elasticity and dielectric properties of the finished rubber remain essentially stable in a broad temperature range from -40 °C to +200 °C.
A mixing ratio of 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Good adhesion on various materials
- Low viscosity
- Good temperature resistance
- UL 94 V0-listed
Applications:
Thanks to its elastic properties and the long-term thermal resistance, the Bectron® SK 75V1-35 system is used successfully for encapsulating pressure-sensitive devices and for protecting motor windings in hot air systems. The Bectron® SK 75V1-35 system is also used generally to protect electronic parts and circuits, such as high-power semiconductors and high-load resistors.
Clear, transparent materials
Clear solutions for casting and coating applications
Bectron® PU 4501 with hardener Bectron® PH 4901 forms a two-component system that cures to a very soft, transparent, elastic polyurethane plastic. The low-viscous resin/hardener mixture is suitable for potting and coating applications.
Properties:
- The resin compound cures with low shrinkage and heat development to a stress-free clearly cured resin
- The high elasticity ensures good temperature cycle behaviour
- Flexible down to -50 °C
- Low shrinkage
- Good dielectric properties
- Good adhesion on many materials
- ROHS-compliant
Applications:
- Suitable for potting and coating when the material needs to be visible
- Bonded circuits
- Sensors
- Reed relays
- LEDs
- SMD-components on printed circuit boards (rigid and semi-flexible) and on ceramic substrates
Bectron® SG 75V1-15 mixed with Bectron® SG 79V1-15 cures at room temperature to a transparent gel in approx. 24 hours. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -45 °C to +200 °C. A mixing ratio of 1:1 permits simple, safe processing of the system. If necessary, a soft, sticky gel can be obtained by changing the mixing ratio.
Properties:
- Addition-crosslinked system
- Curing at room temperature
- Curing can accelerated with heat
- Long-term thermal resistance
- Transparent and elastic
- Low hardness
Applications:
Bectron® SG 75V1-15 crosslinked with BECTRON SG 79V1-15, is specially developed for protecting electronic components from mechanical load and vibrations. Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-15 system is ideal for potting semiconductors in power modules.
Bectron® SG 75V1-75 mixed with Bectron® SG 79V1-75 cures at room temperature and forms a transparent gel in about 15 minutes. The elasticity and dielectric properties of the finished gel remain essentially stable in a broad temperature range from -40 °C to +180 °C. A mixing ratio 1:1 permits simple, safe processing of the system.
Properties:
- Addition curing system
- Rapid curing at room temperature
- Long-term heat resistance
- Transparent and elastic
- Soft, elastic self-repairing gel
Applications:
- Bectron® SG 75V1-75, crosslinked with Bectron® SG 79V1-75, is specially developed for protecting electronic components from mechanical load and vibrations
- Thanks to its high thermal resistance and low ion content, the Bectron® SG 75V1-75 system is ideal for potting semiconductors in power modules.
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Do you have any questions about potting coatings or would you like to talk?
Feel free to contact us. We look forward to talking with you.
You are also welcome to call me directly: +49 40 75 24 9165
Sincerely,
Dr. Maria Speiser
