THERMOPLASTICS
Hotmelt moulding machines work at lower temperatures and far lower pressures than in normal plastic injection moulding. The process is therefore also called low pressure moulding, or LPM. That is kind to the parts, lets the thermoplastics cure quickly and is relatively cost-effective, without impacting the qualitative characteristics of the method. Our hotmelt moulding materials are suitable for connectors, sensors and even whole electronic modules. They withstand both permafrost and average oven temperatures, are resistant to salt and alcohol and can be put into any required shape.
Finding the right potting material for hotmelt moulding is an art in itself. Cooling times are short, with just a few seconds for total enclosure of even the most filigree parts without leaving any cavities, while still coming out of the machine undistorted. We offer comprehensive advice, take care of tool design and toolmaking and even provide the entire processing technology from tank to extruder, so all you actually need to do is to choose the colour.
Thermoplastics are highly valued in the field of component protection for several reasons:
Benefit from our comprehensive experience, material know-how and expertise for sustainable component protection, and from the fact that we advocate just one trustworthy, proven partner: THERMELT.
If you have any questions about our range of hotmelt moulding materials, we look forward to hearing from you so that we can give you specific advice about your individual project-related requirements.
BOSTIK offers a comprehensive product range for every solution you could wish for. The hotmelt moulding materials by BOSTIK – potting resins based on copolymer polyamides – can be brought into any required shape.
THERMELT 195 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for potting electronics/electronic components, connections and cables.
THERMELT 817 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 858 black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 861 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 861 HV black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Only used for coating electronics/electronic components, connections and cables.
THERMELT 865 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
Mainly for automotive applications (natural).
THERMELT 867 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 867 HV black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 8672 black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 868 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Applications:
Mainly used for coating and potting electronics/electronic components, connections and cables.
THERMELT 869 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 875 natural is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 892 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Applications:
Mainly used for coating and potting electronics/electronic components, connections and cables.
Do you have any questions about thermoplastics, or would you like to exchange with us?
Feel free to get in contact with us now. My colleagues and I look forward to exchanging with you.
You can also reach out to me directly by calling: +49 40 75 24 9165
Yours sincerely,
Dr. Maria Speiser