THERMOPLASTICS
Hotmelt moulding materials for connectors, sensors and whole modules
Hotmelt moulding machines work at lower temperatures and far lower pressures than in normal plastic injection moulding. The process is therefore also called low pressure moulding, or LPM. That is kind to the parts, lets the thermoplastics cure quickly and is relatively cost-effective, without impacting the qualitative characteristics of the method. Our hotmelt moulding materials are suitable for connectors, sensors and even whole electronic modules. They withstand both permafrost and average oven temperatures, are resistant to salt and alcohol and can be put into any required shape.
Finding the right potting material for hotmelt moulding is an art in itself. Cooling times are short, with just a few seconds for total enclosure of even the most filigree parts without leaving any cavities, while still coming out of the machine undistorted. We offer comprehensive advice, take care of tool design and toolmaking and even provide the entire processing technology from tank to extruder, so all you actually need to do is to choose the colour.
Hotmelt moulding materials by BOSTIK
PROTECTIONWERNER WIRTH and BOSTIK. Two strong partners for sustainable component protection
Benefit from our comprehensive experience, material know-how and expertise for sustainable component protection, and from the fact that we advocate just one trustworthy, proven partner: THERMELT.
If you have any questions about our range of hotmelt moulding materials, we look forward to hearing from you so that we can give you specific advice about your individual project-related requirements.
Product details
BOSTIK offers a comprehensive product range for every solution you could wish for. The hotmelt moulding materials by BOSTIK – potting resins based on copolymer polyamides – can be brought into any required shape.
THERMELT 195 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- High strength/hardness
- Flammability class UL94: V2 (UL file E116659)
Applications:
Mainly used for potting electronics/electronic components, connections and cables.
THERMELT 817 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Low viscosity
- Flammability class: UL94: V0 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 858 black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Increased UV resistance
- High Shore hardness and cohesion
- Flammability class UL94: V0 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 861 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Mainly for industrial applications
- Standard hotmelt polyamide
- Flammability class UL94: V0 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 861 HV black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Phthalate-free
Applications:
Only used for coating electronics/electronic components, connections and cables.
THERMELT 865 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- High strength
- Standard hotmelt polyamide
- High resistance to brittleness
- Flammability class black: UL94: V0 (UL file E116659)
- Flammability class natural: UL94: V2 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
Mainly for automotive applications (natural).
THERMELT 867 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Standard hotmelt polyamide
- Mainly for industrial and automotive applications
- Versatile product in terms of processes and performance
- Flammability class: UL94: V0 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 867 HV black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Phthalate-free
- Flammability class: UL94: V0 (UL file number E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 8672 black is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Standard polyamide, mainly for automotive applications
- Versatile product in terms of processes and performance
- Flammability class: UL94: HB (UL file E116659)
- RTI Electrical 110 °C (UL file)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 868 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Applications:
Mainly used for coating and potting electronics/electronic components, connections and cables.
THERMELT 869 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Mainly for industrial applications
- Standard hotmelt polyamide
- Flammability class: UL94: V2 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 875 natural is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Properties:
- Mainly for industrial applications
- Standard hotmelt polyamide
- Flammability class: UL94: V0 (UL file E116659)
Applications:
Mainly used for coating electronics/electronic components, connections and cables.
THERMELT 892 is a copolymer polyamide potting resin, non-reactive and solvent-free, specially developed for low pressure moulding.
Applications:
Mainly used for coating and potting electronics/electronic components, connections and cables.
Any questions?
CONTACTWir sind für Sie da!
WERNER WIRTH is the right point of contact at all times – from planning and engineering in advance and selecting the right materials through to optimisation once things are up and running. Challenge us – and you’ll see that something happens that is actually forbidden: we’ll soon spark your enthusiasm once we get talking: +49 40 75 24 91-0 or
