In May 2023, we presented ourselves at two trade fairs to showcase our solutions in the areas of component protection and connection technology to a wide audience. From 09.05. to 11.05.2023, our team was at the SMTconnect in Nuremberg, followed by the Hungexpo Industry Days in Budapest from 16 to 19.05.2023.

In Nuremberg, we were on site together with the Fraunhofer Institute for Reliability and Microintegration IZM Berlin and presented our solutions in the field of component protection. Our Alpha 6 was part of the production line “Future Packaging” of the IZM and was presented by us to the interested audience during the line tours.

In addition to the protection of assemblies and components, we also presented Zierick connectors for the wire-to-board and board-to-board sectors on the “Future Packaging” PCB. E-bike connectors were also part of our exhibited portfolio.

In Budapest, we were guests at the exhibition stand of Komax Hungary Kft, with whom we have been working for around 15 years. Here, too, we had the opportunity to present our solutions in the component protection segment and to make interesting contacts at the fair.