We are pleased to participate in SMTconnect from 09.05. to 11.05.2023 in Nuremberg and cordially invite you to visit us at our booth. SMTconnect is one of the most important trade fairs in Europe where you can find out about innovations in the development, production and application of electronic assemblies.

Together with the Fraunhofer Institute for Reliability and Microintegration IZM, we will be on site to present our solution in the field of component protection: the Alpha 6. Our coating and dispensing system is part of the “Future Packaging” production line and ensures live on-site protection of the components on the assembly. Please feel free to come by and exchange ideas with our experts.

Hall 5, Booth 434

Get your free ticket:
ticket@wernerwirth.com

Download Press release